At the electronica 2024 trade fair in Munich, Bosch is showcasing its latest advancements in microelectronics, emphasizing innovations designed to enhance vehicle safety and the overall driving experience. Key highlights include a groundbreaking transceiver—the NT156 CAN SIC XL—that supports the newly standardized CAN XL protocol, capable of data transmission rates up to 20 Mbit/s. This development addresses the demands of modern vehicle architectures by enabling rapid data transfer while maintaining compatibility with existing CAN networks and allowing the transmission of higher-layer protocols such as IP.
Bosch is also presenting its new system-on-a-chip (SoC) solutions, the SX600 and SX601, which are designed for high-performance radar systems operating in the 77 GHz band. The SX600 is tailored for cost-effective applications, while the more advanced SX601 provides greater processing power and memory, enabling detection ranges approximately 30 percent beyond the current market standard. These chips are built with 22nm RFCMOS technology and include a full millimeter-wave frontend and digital signal processing capabilities, making them suitable for AI-based signal evaluation and flexible connectivity through CAN XL and Ethernet interfaces.
Additionally, Bosch is introducing the SMP290, a Bluetooth-enabled MEMS sensor module for tire-pressure monitoring systems (TPMSs). This single-chip solution integrates various sensors and supports BLE 5.3, ensuring secure, bidirectional communication. The compact design seamlessly integrates with existing vehicle radio systems, enhancing data collection and overall safety. Bosch’s exhibit also features second-generation silicon carbide (SiC) MOSFETs for electrified vehicles, showcasing improved switching capabilities and minimal resistance, which contribute to the development of more efficient electric powertrains.
