ENGINEERING

Shell has unveiled its Triple 10 Challenge concept car as a proof of concept for next-generation EV design. The project centers on a smaller...

Valeo and Calyos have signed an MoU to develop passive two-phase cooling for chips. The agreement targets mobility and data center applications, where heat...

Nexperia announced 1200 V silicon carbide MOSFETs in QDPAK packaging. This top-side cooled surface-mount package optimizes high-power density applications effectively. The new devices extend...

Infineon has introduced a 1300 V silicon carbide module for EV inverters that can run continuously at 205 C. The company says this is...

Modern vehicles require efficient power solutions to handle advanced electronic systems. The transition from traditional 12V architectures to advanced high-performance 48V power platforms addresses...

Automotive domain architecture centers around high-performance systems-on-a-chip. Advanced driver assistance systems need stable power regulation. Driver monitoring systems demand low-voltage and high-current electrical operation.Traditional...

NOVOSENSE Microelectronics recently launched several new products within its SafeNovo safety portfolio. These advanced semiconductor solutions specifically target the growing functional safety automotive market....

Electric drives rely on inverters as their central heart component. These devices manage energy flow from battery to motor precisely. Fraunhofer IZM redesigned this...

Nexteer Automotive has moved its Steer‑by‑Wire (SbW) system into series production for a leading Chinese new‑energy‑vehicle (NEV) OEM. This marks the first time the...

Bosch’s 3rd-gen silicon‑carbide (SiC) chips target the heart of electric‑vehicle efficiency. They manage how energy flows between the battery and the motor. This control...