SecOC Integration Simplifies Automotive Security

RemotiveLabs says SecOC is now integrated into RemotiveBroker, its platform core. The update focuses on secure message authentication for modern automotive communication. It aims...

Mercedes-Benz Axial Flux Motor: Key Tech Wins

Mercedes-Benz has moved its axial flux motor program from concept to production. The Berlin-Marienfelde plant now builds a motor architecture that promises high output,...

Sensata Launches Active + Passive PyroFuse

Sensata Technologies has introduced its Active + Passive PyroFuse, a high-voltage protection device designed for electrified systems. The new STPS500P Series combines system-triggered and...

New Hybrid Transmission: Simpler Mechanics, More Range

Faraday Future has obtained a U.S. patent for a new range-extending hybrid transmission system. It is designed to boost driving range and simplify powertrain...

SK keyfoundry Strengthens Automotive EMC Reliability

SK keyfoundry has developed a Bi-SCR-based on-chip EMC protection technology and already applied it to 0.13-micron BCD products in mass production. The company says...

Shell Triple 10 Concept Reframes EV Efficiency

Shell has unveiled its Triple 10 Challenge concept car as a proof of concept for next-generation EV design. The project centers on a smaller...

Europe’s Electric Car Sales Hit Record

European battery electric vehicle registrations reached a stunning 23.6% market share in May 2026. This figure represents 212,387 units sold across 17 key European...

ZF Bus Technologies: Electric Axle, ADAS, Telematics

ZF demonstrated cutting-edge bus technologies at busworld Türkiye 2026 that support safer and more reliable bus operations. The company addressed key challenges manufacturers and...

Hirose FX36 Connector: High Heat and Vibration Resistance

Hirose Electric launched the FX36 series connectors. It is a 0.5 mm pitch board-to-board connector built for BEV and HEV powertrain equipment. The company...

Valeo and Calyos: Passive Cooling for Chips

Valeo and Calyos have signed an MoU to develop passive two-phase cooling for chips. The agreement targets mobility and data center applications, where heat...
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